10/16/2024
Pfeiffer Vacuum, a member of the global Busch Group, is proud to announce the introduction of its new name and refreshed logo, marking the evolution of the company into Pfeiffer Vacuum+Fab Solutions. This rebranding reflects the comprehensive portfolio of Pfeiffer as a one-stop supplier for both vacuum solutions and semiconductor fab solutions.
Pfeiffer Vacuum is now Pfeiffer Vacuum+Fab Solutions.
The updated logo incorporates a stylistic representation of a turbopump’s rotor blade and stator blade, reflecting the spirit of innovation that has always defined the company and will continue to shape the vacuum industry.
The introduction of the new name and logo marks the 70th anniversary of the company’s first major innovation. In 1954 and 1955, the turbomolecular vacuum pump was developed at Pfeiffer – a technology that revolutionized the world of vacuum. Today, within the Busch Group, Pfeiffer is a world-leading provider of solutions for high and ultra-high vacuum technology with a comprehensive product portfolio also including leak detectors, measurement and analysis devices, components as well as vacuum chambers and systems.
“Our new logo is more than just a trademark. It tells our story, which began with the invention of the turbopump and became a global success. Our teams design and manufacture products that are used in the world’s most high-tech applications and future megatrends, exploring the frontiers of knowledge,” said Wolfgang Ehrk, CEO, Pfeiffer.
About Busch Group
The Busch Group is one of the world’s largest manufacturers of vacuum pumps, vacuum systems, blowers, compressors and gas abatement systems. Under its umbrella, the group houses three well-known brands: Busch Vacuum Solutions, Pfeiffer Vacuum+Fab Solutions and centrotherm clean solutions. The Busch Group manufactures in its 19 own production plants in China, the Czech Republic, France, Germany, India, Romania, South Korea, Switzerland, the United Kingdom, the U.S. and Vietnam. For more information, visit https://www.buschvacuum.com.
